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US Patent Issued to TEXAS INSTRUMENTS on July 14 for "Methods of separating semiconductor dies" (Texas Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,060, issued on July 14, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Methods of separating semiconductor dies" was invented by Michael... और पढ़ें


US Patent Issued to ASM IP Holding on July 14 for "Apparatus and method for removal of oxide and carbon from semiconductor films in a single processing chamber" (Arizona, Massachusetts Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,061, issued on July 14, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Apparatus and method for removal of oxide and carbon fr... और पढ़ें


US Patent Issued to SCREEN HOLDINGS on July 14 for "Substrate cleaning device and substrate cleaning method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,062, issued on July 14, was assigned to SCREEN HOLDINGS Co. LTD. (Japan). "Substrate cleaning device and substrate cleaning method" was inv... और पढ़ें


US Patent Issued to EBARA on July 14 for "Pre-wet module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,063, issued on July 14, was assigned to EBARA Corp. (Tokyo). "Pre-wet module" was invented by Mitsutoshi Yahagi (Tokyo). According to the ... और पढ़ें


US Patent Issued to Tokyo Electron on July 14 for "Wet processing system and nozzle for dispensing a liquid laterally across a semiconductor wafer" (New York Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,064, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Wet processing system and nozzle for dispensing a liquid laterally ac... और पढ़ें


US Patent Issued to Yield Engineering Systems on July 14 for "Unified rinse and dry cleaning apparatus and methods" (Indian Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,065, issued on July 14, was assigned to Yield Engineering Systems Inc. (Fremont, Calif.). "Unified rinse and dry cleaning apparatus and met... और पढ़ें


US Patent Issued to Tokyo Electron on July 14 for "Etching control system and etching control method" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,066, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Etching control system and etching control method" was invented by To... और पढ़ें


US Patent Issued to DISCO on July 14 for "Wafer processing method and wafer processing system" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,067, issued on July 14, was assigned to DISCO Corp. (Tokyo). "Wafer processing method and wafer processing system" was invented by Yuki Ino... और पढ़ें


US Patent Issued to Tokyo Electron on July 14 for "Substrate processing method and substrate processing apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,068, issued on July 14, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... और पढ़ें


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Manufacturing method of the semiconductor package, pick and place device, and workpiece handling apparatus" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,069, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Manufacturing method of the semicon... और पढ़ें